Honda Motor Co., Ltd. (Honda) today announced a memorandum of understanding (MOU) outlining Honda and IBM's intent to collaborate on long-term collaborative research and development of next-generation computing technologies¹ needed to overcome related challenges. announced that it had signed. processing power, power consumption, and design complexity to realize software defined vehicle The future of (SDV).
Applications of intelligence/AI technologies are expected to accelerate broadly from 2030 onwards, creating new opportunities for SDV development.
read more: RingCentral enhances Avaya Cloud Office with RingSense AI and Microsoft Teams integration
Honda and IBM expect SDV to significantly increase design complexity, processing performance, and corresponding power consumption. semiconductor Comparison with traditional mobility products. To meet the anticipated challenges and achieve a competitive SDV, it is important to develop unique research and development capabilities in next-generation computing technologies. Based on this understanding, both companies began exploring long-term joint research and development opportunities.
In particular, this MOU will support Brain-Inspired Computing 2, chiplet technologyIt aims to significantly improve processing performance and reduce power consumption at the same time.hardware and Software co-optimization Important for high performance and fast time to market. To realize these benefits and manage the complexity of future SDV designs, the companies also plan to explore open and flexible software solutions.
Through this collaboration, the two companies aim to realize an SDV with world-class computing performance and power-saving performance.
(1) Computing technology that is being developed with the aim of achieving both high processing performance and low power consumption in the 2030s and beyond.
(2) computer architectures and algorithms that mimic brain structure and function while being optimized for silicon;
Key insights: 10 AI ML trends in supply chain management to watch in 2024
Source: Hottle Motor Co., Ltd.
